www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 1 of 8 s pec n o : ? ? s s p p e e c c i i f f i i c c a a t t i i o o n n customer product ? saw filter model no hdf 4 1 4.5at smd - 3 prepared checked approved ? d a t e 200 8 - 8 - 1 4 ? ? ?? shoulder electronics limited ?? c ustomer received: c hecked ? approved d ate
saw filter hdf 4 1 4.5at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 2 of 8 ?? history record date spec . no . ?? part no . ??? customer no . modify content ? remark
saw filter hdf 4 1 4.5at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 3 of 8 1. scope this specification shall cover the characteristics of saw filter with f4 1 4.5at used for the page system. 2. electrical specification ac voltage vpp 10v50hz/60hz operation temperature - 20 to +60 storage temperature - 45 to +85 rf power dissipation 2 3 dbm electronic characteristics 2 - 1.typical frequency response 2 - 2.electrical characteristics part number f4 1 4.5at unit nominal center frequency (fo) 4 1 4.5 mhz insertion loss (4 1 3.0~4 1 6.0mhz) 4.0 max db 0~383mhz 20min db 447mhz~1700mhz 20min db 1700mhz~2500mhz 18min db 409.5mhz 12min db 4 03.0 mhz ~406 .0 mhz 35min db r ipple (in passband) 1.0max db vswr 2.0 max input/output impedance(nominal) 50//0 /pf
saw filter hdf 4 1 4.5at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 4 of 8 3. test circuit 4. dimension 5. environmental characteristics 5 - 1 high temperature exposure subject the device to +85 for 16 hours. then release the filter into the room conditions for 24 hours prior to the measurement. it shall fulfill the specifica tions in table 1. 5 - 2 low temperature exposure subject the device to - 20 for 16 hours. then release the device into the room conditions for 24 hours prio r to the measurement. it shall fulfill the specifications in table 1. 5 - 3 temperature cycling su bject the device to a low temperature of - 40 for 30 minutes. following by a high temperature of +80 for 30 minutes. then release the device into the room conditions for 24 hours prior to the me a surement. it shall meet the specifications in table 1. 5 - 4 resistance to solder heat 1. ground 2. input/output 3. ground 4. ground 5. ground 6. input/output 7. ground 8. ground
saw filter hdf 4 1 4.5at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 5 of 8 dip the device terminals no closer than 1.5mm into the solder bath at 260 10 for 10 1 sec. then release the device into the room conditions for 4 hours. the device shall meet the specifications in table 1. 5 - 5 solderability subject the device terminals into the solder bath at 245 5 for 5s, more than 95% area of the terminals must be covered with new solder. it shall meet the specifications in table 1. 5 - 6 mechanical shock drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in table 1. 5 - 7 vibration subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. the device shall fulfill the specific ations in table 1. 5 - 8 lead fatigue 5 - 8 - 1 pulling test weight along with the direction of lead without an shock 1 kg . the device shall satisfy all the initial characteristics. 5 - 8 - 2 bending test lead shall be subject to withstand against 90 bending with 450g weight in the d i rection of thic kness. this operation shall be done toward both direction. the device shall show no evidence of damage and shall satisfy all the initial electrical characteristics. 6. remark 6.1 static voltage sta tic voltage between signal load & ground may cause det e rioration &destruction of the component. please avoid static voltage. 6.2 ultrasonic cleaning ultrasonic vibration may cause det e ri oration & destruction of the component. please avoid ultrasonic cleaning 6.3 soldering only leads of component may be soldered. please avoid soldering another part of component. 7. packing 7.1 dimensions (1) carrier tape: figure 1 (2) reel: figure 2 (3) the product shall be packed properly not to be dama ged during transportation and storage. 7.2 reeling quantity 1000 pcs/reel 7?? 3000 pcs/reel 13??
saw filter hdf 4 1 4.5at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 6 of 8 7.3 taping structure (1) the tape shall be wound around the reel in the direction shown below. (2) label device name use r product name quantity lot no. (3) leader part and vacant position specifications. 8. tape specifications 8.1 tensile strength of carrier tape: 4.4n/mm width 8.2 top cover tape adhesion (see the below figure) (1) pull off angle: 0~15 o (2) speed: 300mm/min.
saw filter hdf 4 1 4.5at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 7 of 8 (3) force: 20~70g [figure 1] carrier tape dimensions [unit:mm] w f e p0 p1 p2 d0 d1 t1 t2 a b 12.0 0.3 5.5 0.05 1.75 0.1 4.0 0.1 8.0 0.1 2.0 0.05 ? 1.5 0.1 ? 1.0 0.25 0.3 0.05 2.10 0.1 6.40 0.1 5.20 0.1 [figure 2 ]
saw filter hdf 4 1 4.5at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 8 of 8 [unit:mm] a b c d e w t r ? 330 1.0 ? 100 0.5 ? 13 0.5 ? 21 0.8 2 0.5 13 0.3 3 max. 1.0 max.
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